DocumentCode
439060
Title
Hybrid spectral/neural model based integrated control and supervision of a distributed thermal process in IC packaging
Author
Deng, Hua ; Li, Han-Xiong
Author_Institution
Dept. of Manuf. Eng. & Eng. Manage., City Univ. of Hong Kong, China
fYear
2005
fDate
June 8-10, 2005
Firstpage
256
Lastpage
261
Keywords
adhesives; centralised control; curing; electronics industry; integrated circuit packaging; microassembling; neurocontrollers; optimal control; optimisation; process control; reliability; spectral analysis; thermal management (packaging); IC packaging; adhesive die attach; cure schedule optimization; decoupling control; die attachment; distributed thermal process; electronics industry; hybrid spectral-neural model; integrated control; optimal curing; process supervision; reliability; Centralized control; Curing; Integrated circuit modeling; Integrated circuit packaging; Job shop scheduling; Optimal scheduling; Ovens; Temperature control; Temperature sensors; Throughput;
fLanguage
English
Publisher
ieee
Conference_Titel
American Control Conference, 2005. Proceedings of the 2005
ISSN
0743-1619
Print_ISBN
0-7803-9098-9
Electronic_ISBN
0743-1619
Type
conf
DOI
10.1109/ACC.2005.1469942
Filename
1469942
Link To Document