• DocumentCode
    43922
  • Title

    Top Down Scale-Up of Semiconducting Nanostructures for Large Area Electronics

  • Author

    Cheng Sun ; Ahnood, Arman ; Sungsik Lee ; Mathews, Nripan ; Mhaisalkar, Subodh ; Nathan, Arokia

  • Author_Institution
    Sch. of Mater. Sci. & Eng., Nanyang Technol. Univ., Singapore, Singapore
  • Volume
    10
  • Issue
    8
  • fYear
    2014
  • fDate
    Aug. 2014
  • Firstpage
    660
  • Lastpage
    665
  • Abstract
    In this paper, we present a study on electrical and optical characteristics of n-type tin-oxide nanowires integrated based on top-down scale-up strategy. Through a combination of contact printing and plasma based back-channel passivation, we have achieved stable electrical characteristics with standard deviation in mobility and threshold voltage of 9.1% and 25%, respectively, for a large area of 1 ×1 cm2 area. Through use of contact printing, high alignment of nanowires was achieved thus minimizing the number of nanowire-nanowire junctions, which serve to limit carrier transport in the channel. In addition, persistent photoconductivity has been observed, which we attribute to oxygen vacancy ionization and subsequent elimination using a gate pulse driving scheme.
  • Keywords
    carrier mobility; field effect transistors; nanofabrication; nanowires; passivation; photoconductivity; plasma CVD; semiconductor growth; semiconductor materials; thin film transistors; tin compounds; vacancies (crystal); SnO2; carrier transport; contact printing; electrical characteristics; gate pulse driving scheme; large area electronics; n-type tin-oxide nanowires; nanowire-nanowire junctions; optical characteristics; oxygen vacancy ionization; photoconductivity; plasma based back-channel passivation; semiconducting nanostructures; stable electrical characteristics; standard deviation; thin-film transistor; threshold voltage; top-down scale-up strategy; Logic gates; Nanowires; Passivation; Temperature measurement; Thin film transistors; Threshold voltage; Large area electronics; nanowires; plasma- enhanced chemical vapor deposition; top-down integration; uniformity;
  • fLanguage
    English
  • Journal_Title
    Display Technology, Journal of
  • Publisher
    ieee
  • ISSN
    1551-319X
  • Type

    jour

  • DOI
    10.1109/JDT.2014.2312792
  • Filename
    6776429