Title :
First integrated bipolar RF PA family for cordless telephones
Author_Institution :
Siemens AG, Munich, Germany
Abstract :
A 400-600mW 900MHz-2.5GHz RF power amplifier family for ISM/DECT/WLL applications is presented. All PAs are balanced and realized using standard 26GHz bipolar technology which eases system integration for future products. They include additional functions, such as power ramping, antenne switch driver, supply and temperature compensation, not realized in common GaAs technologies. All amplifiers operate between 3 and 4.5V and are mounted in a TSSOP10 package.
Keywords :
Costs; Driver circuits; Packaging; Power amplifiers; Radio frequency; Radiofrequency amplifiers; Radiofrequency integrated circuits; Silicon; Switches; Telephony;
Conference_Titel :
Solid-State Circuits Conference, 1999. ESSCIRC '99. Proceedings of the 25th European
Conference_Location :
Duisburg, Germany
