• DocumentCode
    439777
  • Title

    A packaged 2.4 GHz LNA in a 0.15 µm CMOS process with 2kV HBM ESD protection

  • Author

    Chandrasekhar, V. ; Hung, C.M. ; Ho, Y. ; Mayaram, K.

  • Author_Institution
    Oregon State University, Corvallis, OR, USA
  • fYear
    2002
  • fDate
    24-26 Sept. 2002
  • Firstpage
    347
  • Lastpage
    350
  • Abstract
    This paper presents the first 2.4 GHz LNA with 2kV HBM ESD protection integrated in a 0.15 µm CMOS process. The LNA has been packaged in a standard TQFP48 package and achieves the best overall performance reported to date in a CMOS process at low power. The LNA has a NF of 2.77 dB, an S21of 12.1 dB and an IIP3 of +2.4 dBm at a current consumption of 3 mA from a 1.5V supply. A comparison of this LNA with another LNA having a similar schematic and pinout but without ESD protection demonstrates performance degradation due to the ESD structures at high frequencies. The LNA without ESD protection has a NF of 2.36 dB, an S21of 14 dB and an IIP3 of -2.2 dBm at the same bias condition.
  • Keywords
    Bonding; CMOS process; CMOS technology; Costs; Electrostatic discharge; Impedance matching; Noise measurement; Packaging; Protection; Radio frequency;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference, 2002. ESSCIRC 2002. Proceedings of the 28th European
  • Conference_Location
    Florence, Italy
  • Type

    conf

  • Filename
    1471536