Towards thin film module production using a simplified CIS process

Author

Schee, R. ; Klaer, J. ; Klenk, R. ; Lux-Steine, M. Ch ; Schock, H.-W. ; Meyer, N. ; Luck, I. ; Rühle, U.

Author_Institution

Hahn-Meitner-Inst., Germany

fYear

2005

fDate

3-7 Jan. 2005

Firstpage

219

Lastpage

222

Abstract

A pilot production for large area thin film solar modules based on CuInS₂ (CIS) is operational in Berlin. The targeted product is a substrate type glass-glass module of 65 W_p power output. The production line consists of an inline work flow including five deposition steps. It has a projected output of up to 5 MW_p. The technology is optimized for lowest complexity: sputtering techniques are used for all thickness-defining process steps preventing homogeneity issues on large areas. Rapid thermal processing is applied for compound formation avoiding an elongated tempering line. A minimized number of utilized materials and wide process windows characterize the preparation process. Analyzing the direct manufacturing costs it is shown that a level of 1.50 €/W_p is feasible in industrial production already at a capacity of 5 MW_p/a.

Keywords

copper compounds; cost reduction; indium compounds; rapid thermal annealing; semiconductor device manufacture; solar cells; sputter deposition; tempering; ternary semiconductors; 5 MW; 65 W; CIS process; CuInS₂; compound formation; deposition steps; direct manufacturing costs; elongated tempering line; homogeneity issues; inline work flow; pilot production; production line; rapid thermal processing; sputtering techniques; substrate type glass-glass module; thickness-defining process steps; thin film solar module production; Computational Intelligence Society; Copper; Costs; Etching; Glass; Manufacturing; Optimized production technology; Semiconductor materials; Substrates; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Photovoltaic Specialists Conference, 2005. Conference Record of the Thirty-first IEEE

ISSN

0160-8371

Print_ISBN

0-7803-8707-4

Type

conf

DOI

10.1109/PVSC.2005.1488108

Filename

1488108