DocumentCode :
440075
Title :
Towards thin film module production using a simplified CIS process
Author :
Schee, R. ; Klaer, J. ; Klenk, R. ; Lux-Steine, M. Ch ; Schock, H.-W. ; Meyer, N. ; Luck, I. ; Rühle, U.
Author_Institution :
Hahn-Meitner-Inst., Germany
fYear :
2005
fDate :
3-7 Jan. 2005
Firstpage :
219
Lastpage :
222
Abstract :
A pilot production for large area thin film solar modules based on CuInS2 (CIS) is operational in Berlin. The targeted product is a substrate type glass-glass module of 65 Wp power output. The production line consists of an inline work flow including five deposition steps. It has a projected output of up to 5 MWp. The technology is optimized for lowest complexity: sputtering techniques are used for all thickness-defining process steps preventing homogeneity issues on large areas. Rapid thermal processing is applied for compound formation avoiding an elongated tempering line. A minimized number of utilized materials and wide process windows characterize the preparation process. Analyzing the direct manufacturing costs it is shown that a level of 1.50 €/Wp is feasible in industrial production already at a capacity of 5 MWp/a.
Keywords :
copper compounds; cost reduction; indium compounds; rapid thermal annealing; semiconductor device manufacture; solar cells; sputter deposition; tempering; ternary semiconductors; 5 MW; 65 W; CIS process; CuInS2; compound formation; deposition steps; direct manufacturing costs; elongated tempering line; homogeneity issues; inline work flow; pilot production; production line; rapid thermal processing; sputtering techniques; substrate type glass-glass module; thickness-defining process steps; thin film solar module production; Computational Intelligence Society; Copper; Costs; Etching; Glass; Manufacturing; Optimized production technology; Semiconductor materials; Substrates; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photovoltaic Specialists Conference, 2005. Conference Record of the Thirty-first IEEE
ISSN :
0160-8371
Print_ISBN :
0-7803-8707-4
Type :
conf
DOI :
10.1109/PVSC.2005.1488108
Filename :
1488108
Link To Document :
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