• DocumentCode
    440237
  • Title

    Time Dependency of the Planarization Process in Copper Chemical-Mechanical Polishing

  • Author

    Nguyen, V.H. ; Timmer, B. ; van Kranenburg, H. ; Woerlee, P.H.

  • Author_Institution
    University of Twente, Enschede, The Netherlands
  • Volume
    1
  • fYear
    1999
  • fDate
    13-15 Sept. 1999
  • Firstpage
    260
  • Lastpage
    263
  • Keywords
    Chemical processes; Chemistry; Copper; Integrated circuit interconnections; Planarization; Rough surfaces; Slurries; Surface morphology; Surface roughness; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Device Research Conference, 1999. Proceeding of the 29th European
  • Conference_Location
    Leuven, Belgium
  • Print_ISBN
    2-86332-245-1
  • Type

    conf

  • Filename
    1505489
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=440237