Mechanical lapping, handling and transfer of ultra-thin wafers

Author

Pinel, S. ; Tasselli, J. ; Bailbé, J.P. ; Marty, A. ; Puech, P. ; Estève, D.

Author_Institution

Lab. d´´Analyse et d´´Architecture des Systemes du C.N.R.S., Toulouse, France

Volume

fYear

1999

fDate

13-15 Sept. 1999

Firstpage

268

Lastpage

271

Keywords

Abrasives; Fabrication; Grain size; Integrated circuit interconnections; Lapping; Powders; Semiconductor materials; Silicon; Substrates; Wet etching;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Device Research Conference, 1999. Proceeding of the 29th European

Conference_Location

Leuven, Belgium

Print_ISBN

2-86332-245-1

Type

Filename

1505491

Link To Document