A Hybrid De-Embedding Technique of Eye Diagram Measurement for High-Speed Digital Interconnections

Author

Chi-Fang Huang ; Yen-Lin Chao

Author_Institution

Grad. Inst. of Commun. Eng., Tatung Univ., Taipei, Taiwan

Volume

4

Issue

5

fYear

2014

fDate

May-14

Firstpage

892

Lastpage

895

Abstract

By a modeling technique of equivalent lumped circuit for high-speed interconnections, an innovative method is proposed to predict the physical intrinsic eye diagram. Such a technique is based on the measured impedance profile results of time-domain reflectometry, which includes the electric characteristics both of the connector itself and testing jigs. The latter´s are to be removed to leave the connector´s part only for the eye diagram prediction. This method can be verified further by SPICE simulation and measurement in this paper.

Keywords

electric connectors; electric impedance measurement; embedded systems; equivalent circuits; interconnections; time-domain reflectometry; SPICE simulation; connector; equivalent lumped circuit technique; high-speed digital interconnection; hybrid deembedding technique; impedance profile measurement; physical intrinsic eye diagram measurement; testing jig; time-domain reflectometry; Connectors; Equivalent circuits; Fixtures; Impedance; Integrated circuit interconnections; Integrated circuit modeling; Transmission line measurements; Equivalent lumped circuit; SPICE model; eye diagram; high-speed interconnections; time-domain reflectometry (TDR); time-domain reflectometry (TDR).;

fLanguage

English

Journal_Title

Components, Packaging and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

2156-3950

Type

jour

DOI

10.1109/TCPMT.2014.2309799

Filename

6776442