DocumentCode
444726
Title
A robust surface integral equation formulation for conductive media
Author
Yun-Hui Chu ; Chew, Weng Cho
Author_Institution
Agilent Technol., Westlake Village, CA
Volume
1B
fYear
2005
fDate
2005
Firstpage
348
Abstract
A new surface integral equation (SIE) formulation is proposed in this work by tuning the coefficients for the external and internal equations. The present formulation provides satisfactory performance over a significantly larger range of skin depths than existing SIE formulations. It is also confirmed that the mesh density does not necessarily follow the increasing wavenumber for the conductive region as long as the mesh is fine enough to approximate the solution
Keywords
computational electromagnetics; conducting bodies; electromagnetic fields; integral equations; conductive media; conductive region; robust surface integral equation formulation; wavenumber; Conducting materials; Conductivity; Green function; Integral equations; Isolation technology; Isolators; Region 1; Robustness; Skin; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Antennas and Propagation Society International Symposium, 2005 IEEE
Conference_Location
Washington, DC
Print_ISBN
0-7803-8883-6
Type
conf
DOI
10.1109/APS.2005.1551562
Filename
1551562
Link To Document