Title :
A robust surface integral equation formulation for conductive media
Author :
Yun-Hui Chu ; Chew, Weng Cho
Author_Institution :
Agilent Technol., Westlake Village, CA
Abstract :
A new surface integral equation (SIE) formulation is proposed in this work by tuning the coefficients for the external and internal equations. The present formulation provides satisfactory performance over a significantly larger range of skin depths than existing SIE formulations. It is also confirmed that the mesh density does not necessarily follow the increasing wavenumber for the conductive region as long as the mesh is fine enough to approximate the solution
Keywords :
computational electromagnetics; conducting bodies; electromagnetic fields; integral equations; conductive media; conductive region; robust surface integral equation formulation; wavenumber; Conducting materials; Conductivity; Green function; Integral equations; Isolation technology; Isolators; Region 1; Robustness; Skin; Testing;
Conference_Titel :
Antennas and Propagation Society International Symposium, 2005 IEEE
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-8883-6
DOI :
10.1109/APS.2005.1551562