Title :
Package-level integration of LTCC antenna
Author :
Sang-Hyuk Wi ; Yong-Bin Sun ; In-Sang Song ; Sung-Hoon Choa ; Jong-Gwan Yook
Author_Institution :
Dept. of Electr. & Electron. Eng., Yonsei Univ., Seoul
Abstract :
In this paper, a stacked patch antenna is designed and integrated in a package using a low temperature co-fired ceramic (LTCC) process for 5 GHz application. The total size of the package is 10.3 times 10.3 times 1.3 mm3 and this package contains 8.3 times 8.3 times 0.7 mm3 space for integration of chip scale packaged components. Numerical analysis exhibits that the designed antenna has two neighboring resonant frequencies of 5.264 GHz and 5.355 GHz with 140 MHz impedance bandwidth, while measured resonant frequencies occur slightly higher frequency region due to manufacturing tolerances
Keywords :
ceramics; chip scale packaging; microstrip antennas; 140 MHz; 5 GHz; 5.264 GHz; 5.355 GHz; LTCC antenna; chip scale packaged components; low temperature cofired ceramic process; package-level integration; stacked patch antenna; Antenna measurements; Bandwidth; Ceramics; Chip scale packaging; Frequency measurement; Impedance measurement; Numerical analysis; Patch antennas; Resonant frequency; Temperature;
Conference_Titel :
Antennas and Propagation Society International Symposium, 2005 IEEE
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-8883-6
DOI :
10.1109/APS.2005.1551573
