Package-level integration of LTCC antenna

Author

Sang-Hyuk Wi ; Yong-Bin Sun ; In-Sang Song ; Sung-Hoon Choa ; Jong-Gwan Yook

Author_Institution

Dept. of Electr. & Electron. Eng., Yonsei Univ., Seoul

Volume

1B

fYear

2005

fDate

2005

Firstpage

389

Abstract

In this paper, a stacked patch antenna is designed and integrated in a package using a low temperature co-fired ceramic (LTCC) process for 5 GHz application. The total size of the package is 10.3 times 10.3 times 1.3 mm³ and this package contains 8.3 times 8.3 times 0.7 mm³ space for integration of chip scale packaged components. Numerical analysis exhibits that the designed antenna has two neighboring resonant frequencies of 5.264 GHz and 5.355 GHz with 140 MHz impedance bandwidth, while measured resonant frequencies occur slightly higher frequency region due to manufacturing tolerances

Keywords

ceramics; chip scale packaging; microstrip antennas; 140 MHz; 5 GHz; 5.264 GHz; 5.355 GHz; LTCC antenna; chip scale packaged components; low temperature cofired ceramic process; package-level integration; stacked patch antenna; Antenna measurements; Bandwidth; Ceramics; Chip scale packaging; Frequency measurement; Impedance measurement; Numerical analysis; Patch antennas; Resonant frequency; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation Society International Symposium, 2005 IEEE

Conference_Location

Washington, DC

Print_ISBN

0-7803-8883-6

Type

conf

DOI

10.1109/APS.2005.1551573

Filename

1551573