Quasi-static parameter analysis for arbitrary metallization thickness of RF MEMS coupled microstrip lines

Author

Fu, Jia-Hui ; Wu, Qun ; Qin, Yue-Mei ; Gu, Xue-Mai ; Lee, Jong-Chul

Author_Institution

Harbin Inst. of Technol., China

Volume

2B

fYear

2005

fDate

3-8 July 2005

Firstpage

408

Abstract

The paper describes a method to analyze arbitrary metallization thickness on a coupled microstrip line for RF MEMS passive device design. Using a conformal mapping technique, closed-form expression quasi-static parameters for the metallization thickness of coupled microstrip lines are determined. They are found to be accurate compared with simulation tools. By using this method, the even-odd mode impedance of coupled microstrip lines for arbitrary metallization thickness can be obtained.

Keywords

conformal mapping; coupled transmission lines; electric impedance; metallisation; micromechanical devices; microstrip circuits; microstrip lines; waveguide theory; RF MEMS passive device design; arbitrary metallization thickness; closed-form expression; conformal mapping technique; coupled microstrip lines; impedance; microstrip circuit design; quasi-static parameter analysis; Closed-form solution; Conformal mapping; Equations; Geometry; Impedance; Metallization; Microstrip; Permittivity; Radiofrequency microelectromechanical systems; Strips;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation Society International Symposium, 2005 IEEE

Print_ISBN

0-7803-8883-6

Type

conf

DOI

10.1109/APS.2005.1552031

Filename

1552031