DocumentCode
447934
Title
High power LED packaging
Author
Karlicek, Robert F., Jr.
Volume
1
fYear
2005
fDate
27-27 May 2005
Firstpage
337
Lastpage
339
Abstract
In this presentation, the development of high power LEDs will be reviewed, including a review of the power LED chip technologies being used for high power applications, leadframe and submount technologies, injection molded plastics used for power applications and encapsulation materials. Aspects of high volume manufacturing for power LEDs will be discussed and emerging markets for high power LED light engines will be described
Keywords
encapsulation; injection moulding; light emitting diodes; light sources; plastic packaging; reviews; semiconductor device packaging; surface mount technology; LED packaging; encapsulation; high power LED light engine; injection molded plastics; power LED chip technology; review; submount technology; Conducting materials; Costs; Electronic packaging thermal management; Electronics packaging; LED lamps; Light emitting diodes; Optical materials; Optical surface waves; Thermal conductivity; Thermal expansion;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics, 2005. (CLEO). Conference on
Conference_Location
Baltimore, MD
Print_ISBN
1-55752-795-4
Type
conf
DOI
10.1109/CLEO.2005.201771
Filename
1572837
Link To Document