Title :
The future of silicon design
Author :
Makimoto, Tsugio
Author_Institution :
Sony, Tokyo
Abstract :
A collection of slides from the author´s conference presentation is given.
Keywords :
integrated circuit design; silicon; system-in-package; system-on-chip; technological forecasting; microelectronics; silicon design; system-in-package; system-on-chip;
Conference_Titel :
Commercialising Technology and Innovation, 2005. The First IEE International Conference on (Ref. No. 2005/11044)
Conference_Location :
London
Print_ISBN :
0-86341-561-X
