DocumentCode :
4516
Title :
Adaptive and Reliable Clock Distribution Design for 3-D Integrated Circuits
Author :
Xi Chen ; Ting Zhu ; Davis, William Rhett ; Franzon, Paul D.
Author_Institution :
Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
Volume :
4
Issue :
11
fYear :
2014
fDate :
Nov. 2014
Firstpage :
1862
Lastpage :
1870
Abstract :
In this paper, we present novel techniques to handle the complexity and challenges in clock distribution for 3-D integrated circuit. First, we propose a novel active deskew technique to adaptively mitigate the cross-tier variations and the 3-D wiring asymmetry. The new deskew technique neither relies on an accurate through-silicon-vias model nor an accurate reference clock distribution. Second, we design a phase-mixer-based tunable-delay-buffer (TDB), which can be linearly tuned in 360° and tolerant to process-voltage-termperature (PVT) variations. Third, based on the new deskew technique and TDB design, we propose an efficient clock distribution network topology, which can be realized without a need of balanced H-tree. Moreover, a thermal profile-based optimization flow is developed to further improve the power efficiency and reduce design overhead. A case study shows that the proposed techniques are able to largely improve the clock skews. The optimization flow is capable of reducing the design cost to achieve a better tradeoff of the skew performance and the design overhead.
Keywords :
buffer circuits; clock distribution networks; integrated circuit design; integrated circuit packaging; optimisation; thermal management (packaging); three-dimensional integrated circuits; 3D integrated circuits; 3D wiring asymmetry; PVT variations; active deskew technique; clock distribution design; clock distribution network topology; cross-tier variations; phase-mixer-based TDB; phase-mixer-based tunable-delay-buffer; power efficiency; process-voltage-termperature variations; thermal profile-based optimization flow; through-silicon-vias model; Clocks; Delays; Loading; Optimization; Synchronization; Tuning; Wires; 3-D integrated circuit (3-D IC); adaptive; clock distribution; deskew; optimization; process-voltage-temperature (PVT) variation; stacking; thermal profile; through-silicon-via (TSV); tunable-delay-buffer (TDB); tunable-delay-buffer (TDB).;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2014.2361356
Filename :
6930795
Link To Document :
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