Title :
Active Inter Poser (AIP) for chip level optical interconnections
Author :
Hiramatsu, Seiki ; Kinoshita, Masao ; Hiruma, Kenji ; Ishizuka, Takeshi ; Okabe, Masahiro ; Furuyama, Hideto ; Mikawa, Takashi ; Ibaragi, Osamu
Author_Institution :
Dept. of Integration Technol. Res., Association of Super-Adv. Electron. Technol., Tokyo
Abstract :
We have developed active inter poser (AIP) as the E/O interface component in the surface mount technology (SMT). Developed AIP mounted MSM-PD by flip chip bonding can receive 1.25 Gbit/s optical signals through a polymeric waveguide array
Keywords :
flip-chip devices; integrated optics; integrated optoelectronics; metal-semiconductor-metal structures; optical arrays; optical fibre communication; optical interconnections; optical polymers; optical receivers; optical transmitters; optical waveguides; photodiodes; surface mount technology; 1.25 Gbit/s; E/O interface component; active inter poser; chip level interconnections; flip chip bonding; metal-semiconductor-metal photodiode; optical interconnections; optical signals; polymeric waveguide array; receiver active inter poser; surface mount technology; transmitter active inter poser;
Conference_Titel :
Optical Communication, 2002. ECOC 2002. 28th European Conference on
Conference_Location :
Copenhagen
Print_ISBN :
87-90974-63-8
