Surface Defect Imaging of Semiconductor Wafers, Microelectronics, and Spacecraft Structures

Author

Giakos, George C. ; Medithe, A. ; Sumrain, S. ; Sukumar, S. ; Fraiwan, L. ; Orozco, A.

Author_Institution

Dept. of Electr. & Comput. Eng., Akron Univ., OH

Volume

2

fYear

2005

fDate

16-19 May 2005

Firstpage

1129

Lastpage

1133

Abstract

The purpose of this study is to present novel optical imaging techniques, based on all active Muller matrix optical polarimetric principles, for efficient detection, inspection and monitoring of semiconductor and microelectronic components, and spacecraft structure. The experimental results of this study indicate that the polarimetric imaging techniques are highly efficient in detecting defects on semiconductor structures when compared to nonpolarimetric techniques

Keywords

aerospace materials; flaw detection; inspection; monitoring; optical images; polarimetry; semiconductor materials; space vehicles; Muller matrix optical polarimetric principles; Muller polarimetric imaging; linear polarization degree; microelectronic components; optical imaging techniques; polarimetric imaging techniques; semiconductor wafers; spacecraft structures; surface defect imaging; Inspection; Microelectronics; Optical devices; Optical imaging; Optical modulation; Optical polarization; Optical sensors; Optical surface waves; Space technology; Space vehicles; Mueller polarimetric imaging; degree of linear polarization (DOLP); spacecraft structure inspection; wafer semiconductor inspection and microelectronics;

fLanguage

English

Publisher

ieee

Conference_Titel

Instrumentation and Measurement Technology Conference, 2005. IMTC 2005. Proceedings of the IEEE

Conference_Location

Ottawa, Ont.

Print_ISBN

0-7803-8879-8

Type

conf

DOI

10.1109/IMTC.2005.1604319

Filename

1604319