MEMS IC for RF and millimeterwave communications

This paper aims to give an overview of the new architecture that will be embedded with the next generation of RF and millimeterwave modules that will have to feature new functionalities as flexibility and reconfigurability to match with all the standard that are or that will emerge, adaptability, testability to optimize the performances "on demand" in order to improve the autonomy, the reliability. The last issue deals with the miniaturisation that will be necessary to have a higher compactness for the modules and a reduced weight that is crucial for embedded applications.