PEEC model for multiconductor systems including dielectric mesh

Author

Jayabalan, J. ; Ooi, B.L. ; Irene, Ang ; Leong, M.S. ; Iyer, M.K.

Author_Institution

Singapore Nat. Univ., Singapore

Volume

2

fYear

2005

fDate

4-7 Dec. 2005

Abstract

In this paper, an elastomer dielectric mesh with and without metallization is modeled by the partial element equivalent circuit (PEEC) method. The model is verified through frequency domain measurements on a coplanar transmission structure sample. Due to good electrical contactability and mechanical compliance, this material has novel applications for fine pitch wafer level device testing at multi-gigahertz frequencies.

Keywords

coplanar transmission lines; dielectric materials; elastomers; equivalent circuits; frequency-domain analysis; probes; coplanar transmission structure; elastomer dielectric mesh; electrical contactability; fine pitch wafer level device testing; frequency domain measurements; mechanical compliance; multiconductor systems; partial element equivalent circuit method; wafer level package test; Circuit testing; Contacts; Dielectric materials; Dielectric measurements; Equivalent circuits; Frequency domain analysis; Frequency measurement; Materials testing; Metallization; Semiconductor device modeling; Dielectric mesh; PEEC; Wafer Level Package Test;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference Proceedings, 2005. APMC 2005. Asia-Pacific Conference Proceedings

Print_ISBN

0-7803-9433-X

Type

conf

DOI

10.1109/APMC.2005.1606378

Filename

1606378