Title :
PEEC model for multiconductor systems including dielectric mesh
Author :
Jayabalan, J. ; Ooi, B.L. ; Irene, Ang ; Leong, M.S. ; Iyer, M.K.
Author_Institution :
Singapore Nat. Univ., Singapore
Abstract :
In this paper, an elastomer dielectric mesh with and without metallization is modeled by the partial element equivalent circuit (PEEC) method. The model is verified through frequency domain measurements on a coplanar transmission structure sample. Due to good electrical contactability and mechanical compliance, this material has novel applications for fine pitch wafer level device testing at multi-gigahertz frequencies.
Keywords :
coplanar transmission lines; dielectric materials; elastomers; equivalent circuits; frequency-domain analysis; probes; coplanar transmission structure; elastomer dielectric mesh; electrical contactability; fine pitch wafer level device testing; frequency domain measurements; mechanical compliance; multiconductor systems; partial element equivalent circuit method; wafer level package test; Circuit testing; Contacts; Dielectric materials; Dielectric measurements; Equivalent circuits; Frequency domain analysis; Frequency measurement; Materials testing; Metallization; Semiconductor device modeling; Dielectric mesh; PEEC; Wafer Level Package Test;
Conference_Titel :
Microwave Conference Proceedings, 2005. APMC 2005. Asia-Pacific Conference Proceedings
Print_ISBN :
0-7803-9433-X
DOI :
10.1109/APMC.2005.1606378
