Title :
Time-domain vector fitting extracted characteristic model for VLSI interconnects analysis
Author_Institution :
Dept. of Electron. & Inf. Eng.,, Hong Kong Polytech. Univ., Kowloon, China
Abstract :
In this paper, a systematic method for deriving the characteristic model of interconnects from time-domain vector fitting is presented. The method is based on the iteration and convolution of time series by recursion. The approach extracts model parameters from terminal voltage waveforms directly by time-domain vector fitting so that transformation to frequency domain can be avoided and interconnect terminated with active nonlinear loading can be simulated efficiently in SPICE-compatible simulator. Example is given to illustrate the accuracy of the extracted model.
Keywords :
SPICE; VLSI; integrated circuit interconnections; integrated circuit modelling; time-domain analysis; SPICE; VLSI interconnects analysis; frequency domain; terminal voltage waveforms; time-domain vector fitting; Circuit simulation; Data mining; Equivalent circuits; Finite difference methods; Integrated circuit interconnections; Matrix converters; SPICE; Time domain analysis; Very large scale integration; Voltage;
Conference_Titel :
Microwave Conference Proceedings, 2005. APMC 2005. Asia-Pacific Conference Proceedings
Print_ISBN :
0-7803-9433-X
DOI :
10.1109/APMC.2005.1606429