A novel CPW-to-stripline vertical via transition using a stagger via structure and embedded air cavities for V-band LTCC SiP applications

Author

Chul Lee, Young ; Soon Park, Chul

Author_Institution

Div. of Marine Electron. & Commun. Eng., Mokpo Nat. Maritime Univ., South Korea

Volume

2

fYear

2005

fDate

4-7 Dec. 2005

Abstract

We present a novel LTCC CPW-to-stripline (SL) vertical via transition utilizing a novel stagger via (STV) structure and embedded air cavities for 60 GHz system-in-package (SiP) applications. In order to minimize radiation due to abrupt via discontinuity, the STV structure and the air cavities are proposed and implemented in the vertical via transition. The fabricated three-segment transmission line (CPW-SL-CPW) composed of the new vertical via transitions achieves an insertion loss of 1.6 dB and return losses below -10 dB over 60 GHz. The transition loss per STV transition is 0.7 dB at 60 GHz.

Keywords

ceramic packaging; coplanar waveguides; strip line transitions; system-in-package; transmission lines; 0.7 dB; 1.6 dB; 60 GHz; CPW-to-stripline vertical via transition; V-band LTCC SiP applications; embedded air cavities; radiation minimization; stagger via structure; system-in-package; three-segment transmission line; via discontinuity; Coplanar waveguides; Dielectrics; Electromagnetic radiation; Integrated circuit interconnections; Passive circuits; Propagation losses; Temperature; Transceivers; Transmission line discontinuities; Wireless communication; Air cavities; CPW; LTCC; Stripline; transition;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference Proceedings, 2005. APMC 2005. Asia-Pacific Conference Proceedings

Print_ISBN

0-7803-9433-X

Type

conf

DOI

10.1109/APMC.2005.1606522

Filename

1606522