Title :
A novel CPW-to-stripline vertical via transition using a stagger via structure and embedded air cavities for V-band LTCC SiP applications
Author :
Chul Lee, Young ; Soon Park, Chul
Author_Institution :
Div. of Marine Electron. & Commun. Eng., Mokpo Nat. Maritime Univ., South Korea
Abstract :
We present a novel LTCC CPW-to-stripline (SL) vertical via transition utilizing a novel stagger via (STV) structure and embedded air cavities for 60 GHz system-in-package (SiP) applications. In order to minimize radiation due to abrupt via discontinuity, the STV structure and the air cavities are proposed and implemented in the vertical via transition. The fabricated three-segment transmission line (CPW-SL-CPW) composed of the new vertical via transitions achieves an insertion loss of 1.6 dB and return losses below -10 dB over 60 GHz. The transition loss per STV transition is 0.7 dB at 60 GHz.
Keywords :
ceramic packaging; coplanar waveguides; strip line transitions; system-in-package; transmission lines; 0.7 dB; 1.6 dB; 60 GHz; CPW-to-stripline vertical via transition; V-band LTCC SiP applications; embedded air cavities; radiation minimization; stagger via structure; system-in-package; three-segment transmission line; via discontinuity; Coplanar waveguides; Dielectrics; Electromagnetic radiation; Integrated circuit interconnections; Passive circuits; Propagation losses; Temperature; Transceivers; Transmission line discontinuities; Wireless communication; Air cavities; CPW; LTCC; Stripline; transition;
Conference_Titel :
Microwave Conference Proceedings, 2005. APMC 2005. Asia-Pacific Conference Proceedings
Print_ISBN :
0-7803-9433-X
DOI :
10.1109/APMC.2005.1606522
