DocumentCode
453178
Title
MEMS IC for RF and millimeterwave communications
Author
Grenier, K. ; Dubuc, D. ; Coccetti, F. ; Coustou, A. ; Dragomirescu, D. ; Plana, R.
Author_Institution
LAAS-CNRS, Toulouse, France
Volume
2
fYear
2005
fDate
4-7 Dec. 2005
Abstract
This paper aims to give an overview of the new architecture that is embedded with the next generation of RF and millimeter-wave modules that feature new functionalities as flexibility and reconfigurability to match with all the standard that are or that emerge, adaptability, testability to optimize the performances "on demand" in order to improve the autonomy, the reliability. The last issue deals with the miniaturisation that is necessary to have a higher compactness for the modules and a reduced weight that is crucial for embedded applications. On the same time, the number of wireless solutions is increasing very dramatically and that turns out to an extension of the allocated band from RF range to millimeterwave range.
Keywords
bulk acoustic wave devices; micromechanical devices; millimetre wave integrated circuits; modules; polymers; radiofrequency integrated circuits; MEMS integrated circuits; RF communications; RF modules; millimeter-wave communications; millimeter-wave modules; Acoustic materials; CMOS technology; Capacitive sensors; Integrated circuit technology; Micromechanical devices; Millimeter wave technology; Polymers; Radio frequency; Radiofrequency integrated circuits; Sensor arrays;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference Proceedings, 2005. APMC 2005. Asia-Pacific Conference Proceedings
Print_ISBN
0-7803-9433-X
Type
conf
DOI
10.1109/APMC.2005.1606535
Filename
1606535
Link To Document