Design and experimental verification of passive microwave components and circuits using a 0.18 μm FDSOI process

Author

Subramanyam, Guru ; Selke, Dave ; Allen, Andrew ; Axtell, Harold S. ; Orlando, Len ; Quach, Tony ; Creech, Gregory ; Wyatt, Peter ; Chen, Chenson

Author_Institution

Dept. of ECE, Dayton Univ., OH, USA

Volume

1

fYear

2005

fDate

4-6 Oct. 2005

Abstract

Integrated passive components and circuits were designed, fabricated and tested on MIT Lincoln Laboratory´s fully depleted silicon on insulator (FDSOI) technology. Design, modeling, and experimental testing of the interdigitated capacitors (IDCs), and lumped element bandpass filters (BPFs) are reported in this paper. The IDCs were tested up to 10 GHz. The measured IDCs showed good agreement with the modeled IDC. A bandpass filter MMIC was designed for a center frequency of 3.275 GHz and a bandwidth of 1 GHz. The insertion loss of the BPFs ranges from 8.9 dB to 10 dB at the center frequency of the passband. The higher insertion loss of the filter was attributed to lower Q of the LC resonators at S-band frequencies. As far as the authors know, this is the first study on lumped element bandpass filters based on CMOS FDSOI technology.

Keywords

CMOS integrated circuits; MMIC; band-pass filters; capacitors; electron device testing; integrated circuit design; integrated circuit testing; microwave devices; 0.18 micron; 1 GHz; 3.275 GHz; 8.9 to 10 dB; CMOS FDSOI technology; LC resonators; S-band frequency; bandpass filter MMIC; fully depleted silicon on insulator technology; integrated passive components; interdigitated capacitors; lumped element bandpass filters; microwave circuits; passive microwave components; Band pass filters; CMOS technology; Circuit testing; Frequency; Insertion loss; Insulator testing; Integrated circuit technology; Laboratories; Microwave circuits; Silicon on insulator technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference, 2005 European

Print_ISBN

2-9600551-2-8

Type

conf

DOI

10.1109/EUMC.2005.1608799

Filename

1608799