DocumentCode :
453419
Title :
Design and experimental verification of passive microwave components and circuits using a 0.18 μm FDSOI process
Author :
Subramanyam, Guru ; Selke, Dave ; Allen, Andrew ; Axtell, Harold S. ; Orlando, Len ; Quach, Tony ; Creech, Gregory ; Wyatt, Peter ; Chen, Chenson
Author_Institution :
Dept. of ECE, Dayton Univ., OH, USA
Volume :
1
fYear :
2005
fDate :
4-6 Oct. 2005
Abstract :
Integrated passive components and circuits were designed, fabricated and tested on MIT Lincoln Laboratory´s fully depleted silicon on insulator (FDSOI) technology. Design, modeling, and experimental testing of the interdigitated capacitors (IDCs), and lumped element bandpass filters (BPFs) are reported in this paper. The IDCs were tested up to 10 GHz. The measured IDCs showed good agreement with the modeled IDC. A bandpass filter MMIC was designed for a center frequency of 3.275 GHz and a bandwidth of 1 GHz. The insertion loss of the BPFs ranges from 8.9 dB to 10 dB at the center frequency of the passband. The higher insertion loss of the filter was attributed to lower Q of the LC resonators at S-band frequencies. As far as the authors know, this is the first study on lumped element bandpass filters based on CMOS FDSOI technology.
Keywords :
CMOS integrated circuits; MMIC; band-pass filters; capacitors; electron device testing; integrated circuit design; integrated circuit testing; microwave devices; 0.18 micron; 1 GHz; 3.275 GHz; 8.9 to 10 dB; CMOS FDSOI technology; LC resonators; S-band frequency; bandpass filter MMIC; fully depleted silicon on insulator technology; integrated passive components; interdigitated capacitors; lumped element bandpass filters; microwave circuits; passive microwave components; Band pass filters; CMOS technology; Circuit testing; Frequency; Insertion loss; Insulator testing; Integrated circuit technology; Laboratories; Microwave circuits; Silicon on insulator technology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference, 2005 European
Print_ISBN :
2-9600551-2-8
Type :
conf
DOI :
10.1109/EUMC.2005.1608799
Filename :
1608799
Link To Document :
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