Title :
Study on slit pad structure to maintain MMIC characteristics both in on-wafer and on-package conditions in millimeter-wave applications
Author :
Chaki, Shin ; Ishida, Takao ; Notani, Yoshihiro ; Mizukoshi, Takeo ; Sasaki, Yoshinobu ; Komaru, Makio
Author_Institution :
High Frequency & Opt. Device Works, Mitsubishi Electr. Corp., Hyogo, Japan
Abstract :
Slit pad structure has been suggested as a novel probing/bonding pad in order to achieve the same characteristics for MMIC between on-wafer and on-package cases in millimeter-wave applications. The dimensions for the new structure has been estimated with measurement for transmission lines and calculations using a commercial EM simulator (Sonnet EM), while a bonding strength for wire on the slit pad has been confirmed experimentally using wire pulling and pushing tests. As a result, it has become clear that a slit width of 5 μm and a gap, which is a distance between a GND pad and a land pad, of 40 μm are the most adequate dimensions to maintain MMIC characteristics both in on-wafer and on-package in broad frequency range. In addition, it has been demonstrated that the slit pad having the slit width of 5 μm has maintained the same strength for wire bonding compared with wire bonding on a pad without the slit.
Keywords :
MMIC; integrated circuit interconnections; integrated circuit packaging; transmission lines; wafer bonding; 40 micron; 5 micron; EM simulator; GND pad; MMIC characteristics; Sonnet EM; bonding pad; bonding strength; land pad; millimeter-wave applications; on-wafer package; probing pad; slit pad structure; transmission lines; wire bonding; wire pulling test; wire pushing test; Atherosclerosis; Bonding; Costs; Frequency; MMICs; Millimeter wave measurements; Millimeter wave radar; Testing; Transmission line measurements; Wire;
Conference_Titel :
Microwave Conference, 2005 European
Print_ISBN :
2-9600551-2-8
DOI :
10.1109/EUMC.2005.1608816
