• DocumentCode
    453471
  • Title

    Size reduction of MMIC packages using compression approach simulations

  • Author

    Lesage, Jean-Marc ; Loison, Renaud ; Gillard, Raphaël ; Barbier, Thierry ; Mancuso, Yves

  • Author_Institution
    Thales Airborne Syst., Elancourt, France
  • Volume
    1
  • fYear
    2005
  • fDate
    4-6 Oct. 2005
  • Abstract
    In this paper, global EM simulations of packaged MMIC modules are performed using the compression approach. First, this approach is validated thanks to comparisons with measurements. The cover height influence is studied in order to reduce package dimensions. Finally, the choice of the MMIC location inside the package allows the reduction of package cover height without significant performance degradations.
  • Keywords
    MMIC; circuit simulation; integrated circuit packaging; EM simulations; MMIC modules; MMIC packages; compression approach simulations; package size reduction; Bonding; Broadband amplifiers; Capacitors; Electronics packaging; Gallium arsenide; MMICs; Microwave technology; Radio frequency; Radiofrequency amplifiers; Topology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 2005 European
  • Print_ISBN
    2-9600551-2-8
  • Type

    conf

  • DOI
    10.1109/EUMC.2005.1608902
  • Filename
    1608902
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=453471