Title :
Design for manufacturing with increasing variability
Author_Institution :
Silicon Eng. Group, Synopsys Inc., Mountain View, CA
Abstract :
After a brief review of the current DFM solutions, this presentation focuses on three areas: a) TCAD based modeling that brings process parameters into spice models, enabling direct communication between manufacturing and design. b) Stress proximity effects which cause design variability and require better modeling. c) The complexity of interconnect variations in timing analysis
Keywords :
design for manufacture; integrated circuit design; integrated circuit interconnections; technology CAD (electronics); DFM; TCAD based modeling; design for manufacturing; design variability; interconnect variations complexity; process parameters; spice models; stress proximity effects; timing analysis; Design for manufacture; Integrated circuit interconnections; Manufacturing processes; Process design; Proximity effect; Semiconductor device manufacture; Silicon; Stress; Timing; Virtual manufacturing;
Conference_Titel :
ASIC, 2005. ASICON 2005. 6th International Conference On
Conference_Location :
Shanghai
Print_ISBN :
0-7803-9210-8
DOI :
10.1109/ICASIC.2005.1611244
