A Logarithmic Full-Chip Thermal Analysis Algorithm Based on Multi-Layer Green´s Function

This paper derives the multi-layer heat conduction Green´s function, by integrating the eigen-expansion technique and the classic transmission line theories, and presents a logarithmic full-chip thermal analysis algorithm, which is verified by comparisons with a computational fluid dynamics tool (FLUENT). The paper considers Dirichlet´s and general heat convection boundary conditions at chip surfaces. Experimental results show that the algorithm offers superior computing speed, compared to FLUENT and traditional Green´s function based methods. The paper also studies the limitations of the traditional single-layer thermal model