DocumentCode
454392
Title
Panel: Test and Reliability Challenges in Automotive Microelectronics
Author
Sebeke, C. ; Jung, Cheolkon ; Harbich, K. ; Fuchs, Stefan ; Schwarz, Josef ; Goehner, P.
Author_Institution
Robert Bosch GmbH, DE
Volume
1
fYear
2006
fDate
6-10 March 2006
Firstpage
1
Lastpage
1
Abstract
Summary form only given. Absolutely fail-safe operation in any critical situation, highest reliability in day-to-day operation and best-in-class convenience at a reasonable price: all drive innovation in automotive electronics. These goals result in car systems with ever-increasing complexity, challenging every single component, IC and line of code. As electronics´ failure rates are perceived to grow, we introduce root cause analysis, key technologies and new measures that enable carmakers to keep pace. The goal is to introduce test and reliability challenges and respective solutions for automotive systems. Representatives of car companies and suppliers explain their views and practical experiences
Keywords
automotive electronics; failure analysis; integrated circuit testing; automotive microelectronics; fail-safe operation; microelectronics reliability; root cause analysis; test technology; Automotive electronics; Automotive engineering; Failure analysis; Microelectronics; System testing; Technological innovation;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Automation and Test in Europe, 2006. DATE '06. Proceedings
Conference_Location
Munich
Print_ISBN
3-9810801-1-4
Type
conf
DOI
10.1109/DATE.2006.243894
Filename
1656942
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