• DocumentCode
    454392
  • Title

    Panel: Test and Reliability Challenges in Automotive Microelectronics

  • Author

    Sebeke, C. ; Jung, Cheolkon ; Harbich, K. ; Fuchs, Stefan ; Schwarz, Josef ; Goehner, P.

  • Author_Institution
    Robert Bosch GmbH, DE
  • Volume
    1
  • fYear
    2006
  • fDate
    6-10 March 2006
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    Summary form only given. Absolutely fail-safe operation in any critical situation, highest reliability in day-to-day operation and best-in-class convenience at a reasonable price: all drive innovation in automotive electronics. These goals result in car systems with ever-increasing complexity, challenging every single component, IC and line of code. As electronics´ failure rates are perceived to grow, we introduce root cause analysis, key technologies and new measures that enable carmakers to keep pace. The goal is to introduce test and reliability challenges and respective solutions for automotive systems. Representatives of car companies and suppliers explain their views and practical experiences
  • Keywords
    automotive electronics; failure analysis; integrated circuit testing; automotive microelectronics; fail-safe operation; microelectronics reliability; root cause analysis; test technology; Automotive electronics; Automotive engineering; Failure analysis; Microelectronics; System testing; Technological innovation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Automation and Test in Europe, 2006. DATE '06. Proceedings
  • Conference_Location
    Munich
  • Print_ISBN
    3-9810801-1-4
  • Type

    conf

  • DOI
    10.1109/DATE.2006.243894
  • Filename
    1656942