Title :
Extraction of Defect Density and Size Distributions from Wafer Sort Test Results
Author :
Nelson, J.E. ; Zanon, T. ; Desineni, R. ; Brown, J.G. ; Patil, N. ; Maly, W. ; Blanton, R.D.
Author_Institution :
Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA
Abstract :
Defect density and defect size distributions (DDSDs) are key parameters used in IC yield loss predictions. Traditionally, memories and specialized test structures have been used to estimate these distributions. In this paper, we propose a strategy to accurately estimate DDSDs for shorts in metal layers using production IC test results
Keywords :
design for manufacture; integrated circuit testing; integrated circuit yield; DDSD estimation; defect density; defect size distributions; integrated circuit yield; metal layers; production IC test results; wafer sort test results; Circuit testing; Computational modeling; Integrated circuit manufacture; Integrated circuit testing; Integrated circuit yield; Production; Semiconductor device modeling; Silicon; System testing; Yield estimation;
Conference_Titel :
Design, Automation and Test in Europe, 2006. DATE '06. Proceedings
Conference_Location :
Munich
Print_ISBN :
3-9810801-1-4
DOI :
10.1109/DATE.2006.243807
