• DocumentCode
    454482
  • Title

    Minimizing Ohmic Loss and Supply Voltage Variation Using a Novel Distributed Power Supply Network

  • Author

    Budnik, M. ; Roy, K.

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN
  • Volume
    1
  • fYear
    2006
  • fDate
    6-10 March 2006
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    IR and di/dt events may cause ohmic losses and large supply voltage variations due to system parasitics. Today, parallelism in the power delivery path is used to reduce ohmic loss while decoupling capacitance is used to minimize the supply voltage variation. Future integrated circuits, however, exhibit large enough currents and current transients to mandate additional safeguards. A novel, distributed power delivery and decoupling network is introduced reducing the supply voltage variation magnitude by 67% and the future ohmic loss by 15.9W (compared to today´s power delivery and decoupling networks) using conventional processing and packaging techniques in a 130nm technology node
  • Keywords
    distribution networks; power supply circuits; transients; 130 nm; 15.9 W; current transients; decoupling capacitance; decoupling network; distributed power delivery; distributed power supply network; integrated circuits; ohmic loss; packaging techniques; power delivery path; supply voltage variation; Capacitors; Energy consumption; Inductance; Integrated circuit technology; Microprocessors; Packaging; Parasitic capacitance; Power generation; Power supplies; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Automation and Test in Europe, 2006. DATE '06. Proceedings
  • Conference_Location
    Munich
  • Print_ISBN
    3-9810801-1-4
  • Type

    conf

  • DOI
    10.1109/DATE.2006.243979
  • Filename
    1657060