DocumentCode
457548
Title
Modeling of hierarchical power/ground network based on segmentation method for package/board co-design and simulation
Author
Kim, Jaemin ; Jeong, Youchul ; Kim, Jingook ; Lee, Junho ; Shim, Jongjoo ; Kim, Joungho
Author_Institution
KAIST
Volume
1
fYear
2006
fDate
14-18 Aug. 2006
Firstpage
16
Lastpage
19
Keywords
Electronic mail; Frequency domain analysis; Impedance; Integrated circuit packaging; Laboratories; Power supplies; Power system interconnection; Power system modeling; Power system reliability; Resonance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility, 2006. EMC 2006. 2006 IEEE International Symposium on
Conference_Location
Portland, OR, USA
Print_ISBN
1-4244-0293-X
Type
conf
DOI
10.1109/ISEMC.2006.1706254
Filename
1706254
Link To Document