• DocumentCode
    45887
  • Title

    Microelectromechanical Systems (MEMS) Resistive Heaters as Circuit Protection Devices

  • Author

    Coutu, Ronald A. ; Ostrow, Scott A.

  • Author_Institution
    Dept. of Electr. Eng., Air Force Inst. of Technol., Wright-Patterson AFB, OH, USA
  • Volume
    3
  • Issue
    12
  • fYear
    2013
  • fDate
    Dec. 2013
  • Firstpage
    2174
  • Lastpage
    2179
  • Abstract
    With increased opportunities for the exploitation (i.e., reverse engineering) of vulnerable electronic components and systems, circuit protection has become a critical issue. Circuit protection techniques are generally software-based and include cryptography (encryption/decryption), obfuscation of codes, and software guards. Examples of hardware-based circuit protection include protective coatings on integrated circuits, trusted foundries, and macro-sized components that self-destruct, thus destroying critical components. This paper is the first to investigate the use of microelectromechanical systems (MEMS) to provide hardware-based protection of critical electronic components to prevent reverse engineering or other exploitation attempts. Specifically, surface-micromachined polycrystalline silicon to be used as meandering resistive heaters were designed analytically and fabricated using a commercially available MEMS prototyping service (i.e., PolyMUMPs), and integrated with representative components potentially at risk for exploitation, in this case pseudomorphic high-electron mobility transistors (pHEMTs). The MEMS heaters were initiated to self-destruct, destroying a critical circuit component and thwart a reverse engineering attempt. Tests revealed reliable self-destruction of the MEMS heaters with approximately 25 V applied, resulting in either complete operational failure or severely altering the pHEMT device physics. The prevalent failure mechanism was metallurgical, in that the material on the surface of the device was changed, and the specific failure mode was the creation of a short-circuit. Another failure mode was degraded device operation due to permanently altered device physics related to either dopant diffusion or ohmic contact degradation. The results, in terms of the failure of a targeted electronic component, demonstrate the utility of using MEMS devices to protect critical components which are otherwise vulnerable to exploitation.
  • Keywords
    micromechanical devices; ohmic contacts; polymers; power HEMT; resistance heating; semiconductor doping; MEMS devices; MEMS heaters; MEMS prototyping service; MEMS resistive heaters; circuit protection devices; codes obfuscation; critical circuit component; critical electronic components; cryptography; decryption; device operation; dopant diffusion; encryption; failure mechanism; failure mode; hardware-based circuit protection; hardware-based protection; integrated circuits; macrosized components; microelectromechanical systems; ohmic contact degradation; operational failure; pHEMT device physics; protective coatings; pseudomorphic high-electron mobility transistors; reverse engineering; software guards; surface-micromachined polycrystalline silicon; trusted foundries; vulnerable electronic components; Intellectual property; Microelectromechanical systems; PHEMTs; Resistance; Reverse engineering; Thermal conductivity; Circuit protection; microelectromechanical systems (MEMS); resistive heaters; reverse engineering;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2013.2282362
  • Filename
    6626630