Novel Dual-Side Thermal Interfacing of IPM for Elevated-Temperature Applications

Author

Chang, Jie Jay ; Liao, Changming

Author_Institution

Florida State Univ., Tallahassee, FL

Volume

2

fYear

2006

fDate

8-12 Oct. 2006

Firstpage

770

Lastpage

776

Abstract

Novel double-side cooling for integrated power modules (IPM) is developed for elevated-temperature applications. It can reduce the p-n junction temperature rise of the power devices inside by 20% at an equivalent load, thus increasing operating ambient temperatures, which is desirable for integrated motors and elevated-temperature applications. The size and volume associated with conventional cooling mechanism can be reduced. This approach applies and improves commercially off-the-shelf products of IPM without significantly changing the original packaging design and manufacture process

Keywords

cooling; insulated gate bipolar transistors; integrated circuit packaging; power integrated circuits; double-side cooling; dual-side thermal interfacing; high-power integrated circuits; insulated gate bipolar transistors; integrated motors; intelligent power modules; AC motors; Cooling; Copper; Heat transfer; Hybrid electric vehicles; Insulated gate bipolar transistors; Inverters; Multichip modules; P-n junctions; Temperature; elevated-temperature applications; high-voltage and high-power semiconductor devices; integrated power modules; two-side cooling;

fLanguage

English

Publisher

ieee

Conference_Titel

Industry Applications Conference, 2006. 41st IAS Annual Meeting. Conference Record of the 2006 IEEE

Conference_Location

Tampa, FL

ISSN

0197-2618

Print_ISBN

1-4244-0364-2

Electronic_ISBN

0197-2618

Type

conf

DOI

10.1109/IAS.2006.256613

Filename

4025299