Title :
Busbar Design: How to Spare Nanohenries ?
Author :
Guichon, J.-M. ; Aime, J. ; Schanen, J.L. ; Martin, C. ; Roudet, J. ; Clavel, E. ; Arpilliere, M. ; Pasterczyk, R. ; Le Floch, Y.
Author_Institution :
Lab. d´´Electrotechnique de Grenoble, CNRS UMR, Grenoble
Abstract :
This paper intends to compare the many different solutions available to design a busbar interconnection. Starting from a single copper plate and going to multilayer busbars, the influence of the external shape of the sheet, of the number and the nature of holes and apertures are considered. Simulations and measurements are used to determine the stray inductance of the different busbars. Design rules are deduced from the many case studies, based on industrial examples
Keywords :
busbars; copper; inductance; integrated circuit design; integrated circuit interconnections; power convertors; power integrated circuits; busbar interconnection; design rules; multilayer busbars; stray inductance; Apertures; Assembly; Copper; Geometry; Impedance; Inductance; Integrated circuit interconnections; Nonhomogeneous media; Power electronics; Shape;
Conference_Titel :
Industry Applications Conference, 2006. 41st IAS Annual Meeting. Conference Record of the 2006 IEEE
Conference_Location :
Tampa, FL
Print_ISBN :
1-4244-0364-2
Electronic_ISBN :
0197-2618
DOI :
10.1109/IAS.2006.256790
