Title :
Cross-Sectional Conductive Atomic Force Microscopy of CdTe/CdS Solar Cells: Effects of Etching and Back-Contact Processes
Author :
Moutinho, H.R. ; Dhere, R.G. ; Jiang, C.-S. ; Gessert, T. ; Duda, A. ; Young, M. ; Metzger, W.K. ; Li, X. ; Al-Jassim, M.M.
Author_Institution :
Nat. Renewable Energy Lab., Golden, CO
Abstract :
We investigated the effects of the etching processes using bromine and nitric-phosphoric acid solutions, as well as of Cu, in the bulk electrical conductivity of CdTe/CdS solar cells using conductive atomic force microscopy (C-AFM). Although the etching process can create a conductive layer on the surface of the CdTe, the layer is very shallow. In contrast, the addition of a thin layer of Cu to the surface creates a conductive layer inside the CdTe that is not uniform in depth, is concentrated at grains boundaries, and may short circuit the device if the CdTe is too thin. The etching process facilitates the Cu diffusion and results in thicker conductive layers. The existence of this inhomogeneous conductive layer directly affects the current transport and is probably the reason for needing thick CdTe in these devices
Keywords :
II-VI semiconductors; atomic force microscopy; cadmium compounds; copper; diffusion; electrical conductivity; etching; grain boundaries; ohmic contacts; semiconductor thin films; solar cells; AFM; CdTe surface; CdTe-CdS; Cu; Cu diffusion; Cu thin layer; back-contact process; bromine solutions; bulk electrical conductivity; cross-sectional conductive atomic force microscopy; current transport; etching process; grain boundaries; inhomogeneous conductive layer; nitric-phosphoric acid solutions; solar cells; Atomic force microscopy; Chemicals; Conductive films; Conductivity; Copper; Etching; Grain boundaries; Photovoltaic cells; Surface topography; Voltage;
Conference_Titel :
Photovoltaic Energy Conversion, Conference Record of the 2006 IEEE 4th World Conference on
Conference_Location :
Waikoloa, HI
Print_ISBN :
1-4244-0017-1
Electronic_ISBN :
1-4244-0017-1
DOI :
10.1109/WCPEC.2006.279475