Title :
In-situ Observation of Selenization of Cu-Ga-In Metallic Precursors
Author :
Kim, W.K. ; Payzant, E.A. ; Li, S.S. ; Crisalle, O.D. ; Anderson, T.J.
Author_Institution :
Dept. of Chem. Eng., Florida Univ., Gainesville, FL
Abstract :
The reaction pathway of Cu(In1-x,Gax)Se2 formation by the selenization of Cu-Ga-In/Mo/glass precursors was investigated using in-situ high-temperature X-ray diffraction (HT-XRD). The room-temperature XRD pattern shows that Cu11In9, CuIn, and pure In formed during MBE-deposition of the precursor. Selenium powder was placed in wells on the HT-XRD sample holder to provide a Se ambient during selenization. The in-situ HT-XRD observation of selenization of precursors showed that the selenization process of Cu-Ga-In/Mo/glass produces an intermediate CuSe phase in the temperature range of 260 to 370degC. The formation of CIGS is initiated at approximately 260degC, which is close to the initial appearance of CuSe. MoSe2 formation was detected at temperature above approximately 400degC. The Ga composition (x= 0.35~0.39) of the resulting CIGS as estimated by the cell refinement method of XRD data suggests partial evaporation of indium during the temperature ramp annealing
Keywords :
X-ray diffraction; annealing; copper alloys; copper compounds; evaporation; gallium alloys; gallium compounds; glass; high-temperature effects; indium alloys; indium compounds; molecular beam epitaxial growth; molybdenum; powders; semiconductor growth; 260 to 370 C; Cu(In1-xGax)Se2; Cu-Ga-In-Mo; Ga composition; HT-XRD; MBE-deposition; cell refinement method; glass precursors; in-situ high-temperature X-ray diffraction; indium; intermediate CuSe phase; metallic precursors; partial evaporation; reaction pathway; room-temperature XRD; selenium powder; selenization process; temperature ramp annealing; Costs; Glass; Kinetic theory; Manufacturing; Molecular beam epitaxial growth; Powders; Substrates; Temperature; X-ray diffraction; X-ray scattering;
Conference_Titel :
Photovoltaic Energy Conversion, Conference Record of the 2006 IEEE 4th World Conference on
Conference_Location :
Waikoloa, HI
Print_ISBN :
1-4244-0017-1
Electronic_ISBN :
1-4244-0017-1
DOI :
10.1109/WCPEC.2006.279488