DocumentCode :
460115
Title :
Reverse Bias Induced Metastable Effects in Cu(In,Ga)Se2 Photovoltaic Devices
Author :
Halverson, Adam ; Mattheis, Julian ; Rau, Uwe ; Cohen, J.David
Author_Institution :
Dept. of Phys., Oregon Univ., Eugene, OR
Volume :
1
fYear :
2006
fDate :
38838
Firstpage :
519
Lastpage :
522
Abstract :
The effects of reverse bias stressing have been studied on CuInGaSe2 thin-film solar cell devices. Finished cells were subjected to treatments of various levels of negative voltage bias at different temperatures and for different durations. Metastable changes in the defect profiles as measured by drive-level capacitance profiling (DLCP) were observed. Modeling of the effects suggests a mechanism in which a conversion of shallow acceptors to deep acceptors in the high field region near the barrier interface is largely responsible for the changes in the profiles. In addition, we observe a significant decrease in the open-circuit voltage after long exposure to bias, which may result from increased recombination through the larger number of deep defects near the interface. These effects are entirely reversible by annealing at zero bias at 370 K for one hour
Keywords :
annealing; copper compounds; gallium compounds; indium compounds; semiconductor thin films; solar cells; ternary semiconductors; thin film devices; 1 hour; 370 K; CuInGaSe2; annealing; barrier interface; deep acceptors; deep defects; drive-level capacitance profiling; negative voltage bias; open-circuit voltage; photovoltaic devices; reverse bias induced metastable effects; reverse bias stressing; shallow acceptors; thin-film solar cell devices; Admittance; Annealing; Capacitance; Frequency; Metastasis; Photovoltaic cells; Photovoltaic systems; Solar power generation; Temperature measurement; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photovoltaic Energy Conversion, Conference Record of the 2006 IEEE 4th World Conference on
Conference_Location :
Waikoloa, HI
Print_ISBN :
1-4244-0017-1
Electronic_ISBN :
1-4244-0017-1
Type :
conf
DOI :
10.1109/WCPEC.2006.279506
Filename :
4059679
Link To Document :
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