• DocumentCode
    460178
  • Title

    PECVD Silicon Nitride Surface Passivation for High-Efficiency N-Type Silicon Solar Cells

  • Author

    Chen, Florence W. ; Li, Tsu Tsung A ; Cotter, Jeffrey E.

  • Author_Institution
    Centre for Excellence for Adv. Silicon Photovoltaic & Photonics, New South Wales Univ., Syndey, NSW
  • Volume
    1
  • fYear
    2006
  • fDate
    38838
  • Firstpage
    1020
  • Lastpage
    1023
  • Abstract
    In this paper, we show that plasma-enhanced chemical vapor deposited silicon nitride is particularly well suited for surface passivation of n-type silicon wafers and solar cells. The surface passivation quality provided by the silicon nitride on three different important surfaces for high-efficiency n-type solar cells is studied in this work: planar, textured, and boron-diffused surfaces. Exceptional passivation quality on these surfaces is demonstrated in this work. One-sun implied open-circuit voltages of 732 mV, 719 mV, and 683 mV were achieved on 1 ohm.cm planar, 1 ohm.cm textured, and moderately doped (135 ohm/sq) boron-diffused planar surfaces, respectively. A real open-circuit voltage of 719 mV was measured at approximately 1-Sun, 25 degC condition on a voltage test structure device passivated entirely with silicon nitride
  • Keywords
    elemental semiconductors; passivation; plasma CVD; silicon; silicon compounds; solar cells; 25 C; 683 mV; 719 mV; 732 mV; Si; SiN-Si:B; boron-diffused surfaces; high-efficiency n-type silicon solar cells; n-type silicon wafers; open-circuit voltages; plasma-enhanced chemical vapor deposited silicon nitride; surface passivation; Boron; Chemicals; Hafnium; Passivation; Photovoltaic cells; Plasma chemistry; Silicon compounds; Surface texture; Surface treatment; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Energy Conversion, Conference Record of the 2006 IEEE 4th World Conference on
  • Conference_Location
    Waikoloa, HI
  • Print_ISBN
    1-4244-0017-1
  • Electronic_ISBN
    1-4244-0017-1
  • Type

    conf

  • DOI
    10.1109/WCPEC.2006.279292
  • Filename
    4059804