• DocumentCode
    460206
  • Title

    3D-Simulation of EFG Process and Deformation of the Growing Silicon Tube

  • Author

    Behnken, H. ; Franke, D. ; Kasjanow, H. ; Nikanorov, A. ; Seidl, A.

  • Author_Institution
    ACCESS e.V., Aachen
  • Volume
    1
  • fYear
    2006
  • fDate
    38838
  • Firstpage
    1175
  • Lastpage
    1178
  • Abstract
    Octagonally shaped silicon tubes are produced at SCHOTT solar by an Edge-defined Film-fed Growth (EFG) technique. The tubes are grown in induction heated EFG furnaces. For this process we developed a coupled thermal-electromagnetic 3D FE-model which serves for analyzing the influences of process parameters and of geometrical shape of components on the distribution of Joule heat and temperature. The calculated temperature distribution in the silicon tube is further coupled to mechanical FE-simulation of stresses, strains, dislocation density and undulation of the tube faces. The investigations aim at the detailed understanding of the process, the improvement of thickness homogeneity, and reduction of stress and deformation of the tube to improve the production yield and the material properties of EFG-wafers
  • Keywords
    crystal growth from melt; deformation; dislocation density; elemental semiconductors; finite element analysis; semiconductor growth; silicon; EFG process; SCHOTT solar; Si; coupled thermal-electromagnetic 3D FE-model; deformation; dislocation density; edge-defined film-fed growth; induction heated EFG furnaces; mechanical FE-simulation; octagonally shaped silicon tubes; strains; stress; Capacitive sensors; Furnaces; Geometry; Inductors; Plastics; Silicon; Temperature dependence; Temperature distribution; Temperature sensors; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Energy Conversion, Conference Record of the 2006 IEEE 4th World Conference on
  • Conference_Location
    Waikoloa, HI
  • Print_ISBN
    1-4244-0017-1
  • Electronic_ISBN
    1-4244-0017-1
  • Type

    conf

  • DOI
    10.1109/WCPEC.2006.279390
  • Filename
    4059845