DocumentCode
460222
Title
Electrical Analysis of Electronics Packaging
Author
Caggiano, M.F.
Author_Institution
Department of Electrical and Computer Engineering, Rutgers University, NJ, USA
Volume
1
fYear
2006
fDate
5-7 Sept. 2006
Abstract
Summary form only for tutorial.
Keywords
Crosstalk; Electronics packaging; Inductance; Integrated circuit manufacture; Integrated circuit modeling; Integrated circuit noise; Integrated circuit packaging; Parasitic capacitance; RLC circuits; Signal analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location
Dresden
Print_ISBN
1-4244-0552-1
Type
conf
DOI
10.1109/ESTC.2006.279962
Filename
4060686
Link To Document