Title :
FEM Support of Industrial Design for Manufacturing & Reliability in Electronics Packaging
Author :
Rzepka, S. ; Dudek, R. ; Wiese, S.
Author_Institution :
Qimonda, Dresden, Germany
Abstract :
Summary form only for tutorial.
Keywords :
Deformable models; Electronics industry; Electronics packaging; Failure analysis; Inorganic materials; Integrated circuit packaging; Integrated circuit reliability; Manufacturing industries; Materials reliability; Power dissipation;
Conference_Titel :
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location :
Dresden
Print_ISBN :
1-4244-0552-1
DOI :
10.1109/ESTC.2006.279965
