DocumentCode
460226
Title
Thermal Measurements and Qualification IC Packages Using the Transient Method: Principles and Applications
Author
Poppe, A.
Author_Institution
Department of Electron Devices, Budapest University of Technology and Economics, Hungary
Volume
1
fYear
2006
fDate
5-7 Sept. 2006
Abstract
Summary form only for tutorial.
Keywords
Application specific integrated circuits; Integrated circuit packaging; Light emitting diodes; Micromechanical devices; Nondestructive testing; Power measurement; Power system reliability; Qualifications; Semiconductor device packaging; Transient analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location
Dresden
Print_ISBN
1-4244-0552-1
Type
conf
DOI
10.1109/ESTC.2006.279967
Filename
4060691
Link To Document