Title :
Thermal Measurements and Qualification IC Packages Using the Transient Method: Principles and Applications
Author_Institution :
Department of Electron Devices, Budapest University of Technology and Economics, Hungary
Abstract :
Summary form only for tutorial.
Keywords :
Application specific integrated circuits; Integrated circuit packaging; Light emitting diodes; Micromechanical devices; Nondestructive testing; Power measurement; Power system reliability; Qualifications; Semiconductor device packaging; Transient analysis;
Conference_Titel :
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location :
Dresden
Print_ISBN :
1-4244-0552-1
DOI :
10.1109/ESTC.2006.279967
