The Influence of Ultra Fine Solder Powder Related to Wafer Bumping within the Ultra Fine Pitch Arena

Besides the plating process solder paste printing is the most commonly applied production method to electrically connect components and carrier systems. This technology is a proven and stabilized technology serving a worldwide spectrum of applications. The continuously proceeding demand for miniaturization of components, PCBs and completed modules seems to be opposite to the request on larger scale of functionality, higher efficiency and more powerful ICs in general, specifically on memory chips. This leads to smaller pitches both on PCBs as well as on chip level. Today pitches smaller than 100mum already are standard to the industry. Therefore an advanced solder paste printing process had to be adjusted to a competitive level. A vital part of this success became the smallest possible powder particle grain sizes combined with repeatable soldering properties