Title :
The Influence of Ultra Fine Solder Powder Related to Wafer Bumping within the Ultra Fine Pitch Arena
Author :
Protsch, Walter ; Bartels, F. ; Kappeller, Ulrich
Author_Institution :
W.C.Heraeus GmbH, Potsdam
Abstract :
Besides the plating process solder paste printing is the most commonly applied production method to electrically connect components and carrier systems. This technology is a proven and stabilized technology serving a worldwide spectrum of applications. The continuously proceeding demand for miniaturization of components, PCBs and completed modules seems to be opposite to the request on larger scale of functionality, higher efficiency and more powerful ICs in general, specifically on memory chips. This leads to smaller pitches both on PCBs as well as on chip level. Today pitches smaller than 100mum already are standard to the industry. Therefore an advanced solder paste printing process had to be adjusted to a competitive level. A vital part of this success became the smallest possible powder particle grain sizes combined with repeatable soldering properties
Keywords :
chip scale packaging; fine-pitch technology; grain size; particle size; powders; printed circuits; printing; soldering; solders; wafer bonding; PCB; components miniaturization; memory chips; plating process; powder particle grain sizes; solder paste printing; soldering properties; ultra fine pitch arena; ultra fine solder powder; wafer bumping; Chemical technology; Grain size; Lead; Moore´s Law; Powders; Printing; Production; Shape memory alloys; Soldering; Tin;
Conference_Titel :
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location :
Dresden
Print_ISBN :
1-4244-0552-1
Electronic_ISBN :
1-4244-0553-x
DOI :
10.1109/ESTC.2006.279972
