Title :
A SEM and TEM Study of the Interconnect Microstructure and Reliability for a New XFLGA Package
Author :
Bennemann, S. ; Graff, A. ; Schischka, J. ; Petzold, M. ; Theuss, H. ; Dangelmaier, J. ; Pressel, K.
Author_Institution :
Fraunhofer Inst. for Mech. of Mater., Halle
Abstract :
The paper focuses on electron microscopy investigations of board assembly for a new XFLGA package with emphasis on microstructure, intermetallic compound (IMC) and defect formation in solder to package and board metallization interfaces. XFLGA packages with NiAu lead finish were assembled using a commercial SnAg3.5Cu0.7 solder to NiAu- or CuOSP board metallization. The interface microstructure was studied using scanning electron microscopy (SEM) before and after stress testing. Both regarding the discovered intermetallic compounds and crack formation no critical defect processes were detected in the interfaces. This result was further confirmed by focused ion beam (FIB) and transmission electron microscopy (TEM) investigations on a nanometer scale for selected samples. These results support the positive electrical reliability test results and indicate a high stability of the XFLGA component during application conditions
Keywords :
alloys; copper compounds; focused ion beam technology; metallisation; nickel compounds; packaging; scanning electron microscopy; silver compounds; tin compounds; transmission electron microscopy; NiAu; SnAg3.5Cu0.7; XFLGA package; defect formation; focused ion beam; interconnect microstructure; intermetallic compound; scanning electron microscopy; transmission electron microscopy; Assembly; Electron microscopy; Intermetallic; Lead; Metallization; Microstructure; Packaging; Scanning electron microscopy; Testing; Transmission electron microscopy;
Conference_Titel :
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location :
Dresden
Print_ISBN :
1-4244-0552-1
Electronic_ISBN :
1-4244-0553-x
DOI :
10.1109/ESTC.2006.279974
