Title :
Status of Leadfree Automotive Electronics
Author :
Lange, P. ; Herenz, A. ; Laker, O. ; Schall, E. ; Seubert, T.
Author_Institution :
Hella KGaA Hueck & Co., Lippstadt
Abstract :
Hella experiences in lead-free production and product applications over more than 10 years show that the lead-free soldering technology is not an easy drop in solution for the existing leaded soldering standards. The new solder process shows lower ability and higher thermal risk to the components. Solder joint reliability values are higher tolerance caused by complex metallization effects and worster wetting. The field of automotive electronics would be well advised to wait for the experiences and optimizations made in nonautomotive areas this time and in the next years (regarding ROHS) to approach the new technology with optimized lead-free designs and a mature supplier market
Keywords :
RoHS compliance; automotive electronics; metallisation; reliability; soldering; wetting; Hella experiences; ROHS; complex metallization; lead-free automotive electronic; lead-free production; lead-free soldering; optimizations; solder joint reliability; thermal component risk; worster wetting; Automotive electronics; Consumer electronics; Costs; Design optimization; Electronic equipment testing; Lead; Production; Safety; Soldering; Vehicles;
Conference_Titel :
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location :
Dresden
Print_ISBN :
1-4244-0552-1
Electronic_ISBN :
1-4244-0553-x
DOI :
10.1109/ESTC.2006.279994