Demonstration of Optical Interconnection- and Assembly Technique for Fully-Embedded Optical PCB at Data Rates of 10 Gbps/ch

Author

Happel, T. ; Franke, M. ; Nanai, H. ; Schrage, J.

Author_Institution

Siemens AG, Berlin

Volume

1

fYear

2006

fDate

5-7 Sept. 2006

Firstpage

247

Lastpage

252

Abstract

Based on the optical axis conversion (AXC) technology approach of Central Glass Ltd., Japan, Siemens has developed an interconnection- and assembly technique for fully-embedded parallel optical links inside printed circuit boards for board-to-board and chip-to-chip interconnections containing 4-channel multimode waveguides at a data rate of 10 Gbps/ch. over a transmission distance of 60mm. This technology provides an approach to achieve the demand of high-bandwidth for data transmission in printed circuit boards of future datacom applications. Based thereon the scalability to higher bandwidth by a hybrid integrated optoelectronic WDM packages is discussed

Keywords

assembling; hybrid integrated circuits; integrated circuit packaging; integrated optoelectronics; optical interconnections; optical links; printed circuits; wavelength division multiplexing; 4-channel multimode waveguides; 60 mm; Central Glass Ltd.; assembly technique; board-to-board interconnections; chip-to-chip interconnections; data transmission; datacom application; integrated optoelectronic WDM packages; optical axis conversion technology approach; optical interconnection; parallel optical links; printed circuit boards; Assembly; Data communication; Glass; Integrated circuit interconnections; Integrated circuit technology; Optical fiber communication; Optical interconnections; Optical waveguide components; Optical waveguides; Printed circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Systemintegration Technology Conference, 2006. 1st

Conference_Location

Dresden

Print_ISBN

1-4244-0552-1

Electronic_ISBN

1-4244-0553-x

Type

conf

DOI

10.1109/ESTC.2006.280005

Filename

4060729