Properties of Polymer Bumps for Flip Chip Mounting on Moulded Interconnect Devices xs(MID)

Author

Kessler, Ulrich ; Eberhardt, Wolfgang ; Schwenck, Adrian ; Warkentin, Daniel ; Kuck, Heinz

Author_Institution

Hahn-Schickard-Inst. for Micro Assembly Technol., Stuttgart

Volume

1

fYear

2006

fDate

5-7 Sept. 2006

Firstpage

287

Lastpage

290

Abstract

MID technology offers a very interesting alternative for many applications in MEMS and MOEMS suitable for multifunctional 3D packages due to its high capability in miniaturization as well as in reducing the number of components and process steps. To make use of the full potential of MID technology not only SMD assembly has to be considered but also mounting of bare dies. For flip chip mounting MID technology offers a unique assembly solution consisting of polymer bumps (MID bumps) fabricated simultaneously while moulding the substrate. In this paper investigations of the mechanical and geometrical properties and the deformation behaviour of metallized polymer bumps for flip chip assembly are described

Keywords

flip-chip devices; integrated circuit interconnections; moulding; MEMS; MOEMS; flip chip mounting; moulded interconnect devices; multifunctional 3D packages; polymer bumps; Assembly; Conductive adhesives; Flip chip; Gold; Injection molding; Laser theory; Liquid crystal polymers; Mechanical factors; Metallization; Semiconductor device measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Systemintegration Technology Conference, 2006. 1st

Conference_Location

Dresden

Print_ISBN

1-4244-0552-1

Electronic_ISBN

1-4244-0553-x

Type

conf

DOI

10.1109/ESTC.2006.280012

Filename

4060736