Modeling for High-Speed Interconnects in Mobile Device Hinge Structures

Data interconnects have become important functionality determining technology in mobile devices recently. Analysis and modeling of interconnects are integral part of electro-mechanical design of devices that have integrated high pixel count display and mega-pixel camera modules. Several high-speed serial data interfacing solutions have been introduced for data connectivity during last years. Different device form factors create the need for transferring data over hinge using flexible interconnections. The length of the interconnection is highly dependent on the complexity of the hinge structure. The longer interconnect is, the more critical is the electrical performance at high frequencies. Mechanical durability has a major role in the selection of transfer media. Typically flexible printed circuit (FPC) or micro-coaxial (MCX) cables are used. Major design considerations for FPC selection are shielding effectiveness, and selection between different layer structures, from one to three conductor layers. Different shielding materials have been developed to replace the limited bending durability of copper