DocumentCode
460278
Title
Full-Wave Modeling of RF Voltage Drop on Printed Circuit Interconnects
Author
See, Kye Yak ; Chua, Eng Kee ; Liu, Zhihong
Author_Institution
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
Volume
1
fYear
2006
fDate
5-7 Sept. 2006
Firstpage
491
Lastpage
497
Abstract
Based on a full-wave approach, the radio frequency (RF) voltage drop between any two points of any printed circuit interconnect is modeled numerically. The proposed modeling approach has been validated experimentally. The ability to predict the RF voltage drop on any printed circuit interconnects, such as ground conductor, allows designer to assess EMI compliance for a specific layout of signal path on a PCB
Keywords
electric potential; electromagnetic interference; integral equations; integrated circuit interconnections; integrated circuit modelling; printed circuit layout; EMI compliance; RF voltage drop; full-wave modeling; ground conductor; printed circuit interconnects; signal path layout; Conductors; Electromagnetic interference; Electronic circuits; Integral equations; Integrated circuit interconnections; Numerical models; Printed circuits; Radio frequency; Time domain analysis; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location
Dresden
Print_ISBN
1-4244-0552-1
Electronic_ISBN
1-4244-0553-x
Type
conf
DOI
10.1109/ESTC.2006.280047
Filename
4060771
Link To Document