Title :
Full-Wave Modeling of RF Voltage Drop on Printed Circuit Interconnects
Author :
See, Kye Yak ; Chua, Eng Kee ; Liu, Zhihong
Author_Institution :
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
Abstract :
Based on a full-wave approach, the radio frequency (RF) voltage drop between any two points of any printed circuit interconnect is modeled numerically. The proposed modeling approach has been validated experimentally. The ability to predict the RF voltage drop on any printed circuit interconnects, such as ground conductor, allows designer to assess EMI compliance for a specific layout of signal path on a PCB
Keywords :
electric potential; electromagnetic interference; integral equations; integrated circuit interconnections; integrated circuit modelling; printed circuit layout; EMI compliance; RF voltage drop; full-wave modeling; ground conductor; printed circuit interconnects; signal path layout; Conductors; Electromagnetic interference; Electronic circuits; Integral equations; Integrated circuit interconnections; Numerical models; Printed circuits; Radio frequency; Time domain analysis; Voltage;
Conference_Titel :
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location :
Dresden
Print_ISBN :
1-4244-0552-1
Electronic_ISBN :
1-4244-0553-x
DOI :
10.1109/ESTC.2006.280047
