Electronics Packaging for Microfluidics Applications

Microsystems experience an increasing spreading. Itself this increase will express particularly in new products and procedures. For the employment of microsystems speak in particular a high functionality, combined with small energy consumption as well as increased reliability. These components can be manufactured by mass production low-priced. Apart from prognosticated increases with "classical" microsystem products e.g. acceleration sensors just as increases for biological and physical microsystems become expected. Examples are the discussed "micro totally analysis systems" (muTAS) or "lab the on chip" applications. It concerns it high-complex, fluid microsystems, whose manufacturing requires a strong interdisciplinary cooperation. The paper reports the adaptation of conventional electronic packaging techniques for the production of micro-fluid flow chips from glass, silicon and glass silicon hybrid modules. A goal is the development of a reliable, reproducible assembly technology suitable for the mass production of micro-fluid hybrid modules. A possible operational area is the precise handling of biological cells and dielectric particles like polymer beads. The handling of the biological cells takes place under utilization of dielectrophoretic forces via electrical fields