DocumentCode
460288
Title
An FE-Investigation of the State of Stress and Fracture Mechanics Properties of Intermetallic Compounds
Author
Muller, Wolfgang H. ; Hannach, Taoufiq ; Albrecht, Hans-Jurgen
Author_Institution
Inst. fur Mechanik, Technische Univ. Berlin
Volume
1
fYear
2006
fDate
5-7 Sept. 2006
Firstpage
575
Lastpage
582
Abstract
This paper focuses on a finite element analysis of the state of stress and strain within an intermetallic layer at the interface of a lead-free solder joint. The magnitude and sign of the stresses and strains (tensile vs. compressive) is discussed as a function of various parameters, such as the thermo-mechanical properties of the materials constituting the joint, the geometry of the intermetallic phase (stress concentrations), and its potential change in volume during its creation. Moreover the stresses and strains are used to calculate stored energies in order to obtain an estimate for the energy release rates and related fracture mechanics properties of the intermetallics, as a function of the various parameters mentioned before. The findings of this paper can be used to develop guidelines that indicate which materials and geometry parameters to change in order to optimize the interfacial quality from the (theoretical) viewpoint of mechanics
Keywords
alloys; finite element analysis; fracture mechanics; soldering; solders; stress analysis; finite element analysis; fracture mechanics; interfacial quality; intermetallic compounds; intermetallic layer; intermetallic phase geometry; lead-free solder joint; stress concentrations; stress state; stresses-strains analysis; volume change; Capacitive sensors; Compressive stress; Environmentally friendly manufacturing techniques; Finite element methods; Geometry; Intermetallic; Lead; Mechanical factors; Tensile stress; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location
Dresden
Print_ISBN
1-4244-0552-1
Electronic_ISBN
1-4244-0553-x
Type
conf
DOI
10.1109/ESTC.2006.280061
Filename
4060785
Link To Document