• DocumentCode
    460288
  • Title

    An FE-Investigation of the State of Stress and Fracture Mechanics Properties of Intermetallic Compounds

  • Author

    Muller, Wolfgang H. ; Hannach, Taoufiq ; Albrecht, Hans-Jurgen

  • Author_Institution
    Inst. fur Mechanik, Technische Univ. Berlin
  • Volume
    1
  • fYear
    2006
  • fDate
    5-7 Sept. 2006
  • Firstpage
    575
  • Lastpage
    582
  • Abstract
    This paper focuses on a finite element analysis of the state of stress and strain within an intermetallic layer at the interface of a lead-free solder joint. The magnitude and sign of the stresses and strains (tensile vs. compressive) is discussed as a function of various parameters, such as the thermo-mechanical properties of the materials constituting the joint, the geometry of the intermetallic phase (stress concentrations), and its potential change in volume during its creation. Moreover the stresses and strains are used to calculate stored energies in order to obtain an estimate for the energy release rates and related fracture mechanics properties of the intermetallics, as a function of the various parameters mentioned before. The findings of this paper can be used to develop guidelines that indicate which materials and geometry parameters to change in order to optimize the interfacial quality from the (theoretical) viewpoint of mechanics
  • Keywords
    alloys; finite element analysis; fracture mechanics; soldering; solders; stress analysis; finite element analysis; fracture mechanics; interfacial quality; intermetallic compounds; intermetallic layer; intermetallic phase geometry; lead-free solder joint; stress concentrations; stress state; stresses-strains analysis; volume change; Capacitive sensors; Compressive stress; Environmentally friendly manufacturing techniques; Finite element methods; Geometry; Intermetallic; Lead; Mechanical factors; Tensile stress; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Systemintegration Technology Conference, 2006. 1st
  • Conference_Location
    Dresden
  • Print_ISBN
    1-4244-0552-1
  • Electronic_ISBN
    1-4244-0553-x
  • Type

    conf

  • DOI
    10.1109/ESTC.2006.280061
  • Filename
    4060785