Title :
An FE-Investigation of the State of Stress and Fracture Mechanics Properties of Intermetallic Compounds
Author :
Muller, Wolfgang H. ; Hannach, Taoufiq ; Albrecht, Hans-Jurgen
Author_Institution :
Inst. fur Mechanik, Technische Univ. Berlin
Abstract :
This paper focuses on a finite element analysis of the state of stress and strain within an intermetallic layer at the interface of a lead-free solder joint. The magnitude and sign of the stresses and strains (tensile vs. compressive) is discussed as a function of various parameters, such as the thermo-mechanical properties of the materials constituting the joint, the geometry of the intermetallic phase (stress concentrations), and its potential change in volume during its creation. Moreover the stresses and strains are used to calculate stored energies in order to obtain an estimate for the energy release rates and related fracture mechanics properties of the intermetallics, as a function of the various parameters mentioned before. The findings of this paper can be used to develop guidelines that indicate which materials and geometry parameters to change in order to optimize the interfacial quality from the (theoretical) viewpoint of mechanics
Keywords :
alloys; finite element analysis; fracture mechanics; soldering; solders; stress analysis; finite element analysis; fracture mechanics; interfacial quality; intermetallic compounds; intermetallic layer; intermetallic phase geometry; lead-free solder joint; stress concentrations; stress state; stresses-strains analysis; volume change; Capacitive sensors; Compressive stress; Environmentally friendly manufacturing techniques; Finite element methods; Geometry; Intermetallic; Lead; Mechanical factors; Tensile stress; Thermal stresses;
Conference_Titel :
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location :
Dresden
Print_ISBN :
1-4244-0552-1
Electronic_ISBN :
1-4244-0553-x
DOI :
10.1109/ESTC.2006.280061